Veeco AP 300 E Lithography System
- 2.0 um Resolution, Extended Field, ghi-line Broadband Lens Dual 1200 Watt Lamp llluminator
- 68 x 26 mm Field Size
- Lens Distortion Reference - No lens matching - Closed Loop Cooler
- Lens Protection (Requires Closed Loop Cooler)
- Universal Size/Warped Wafer Kit: 200 mm and 300 mm
- Warped Wafer Handling to 500 um
- FOUP Wafer Handling
- Wafer Thickness Handling from 0.4 mm to 2.0 mm PATMAX MVS Alignment System
- MVS Alignment Spectrum of 530 - 570 nm
- 6 Slot Reticle Stack, Manual Front Loading
- 6 x 6 x 0.25 inch Reticle Type
- Dual Flip Aperture: ([68mm/44mm/34.2mm] x 26mm)
- Enhanced Bottom Pellicle
- Power Source: 208 V three phase, 5 wire, 150 amp
- Environmental Chamber, Shipped From Supplier (White)
- GEM HSMS Communications
- ghi-line Auto Filter Changer
- Open Cassette Adapter (QTY 2)
- Edge Exposure System (WEE 3)
- Edge Exclusion System with one Exclusion Ring Specify exclusion ring width 1 - 5 mm protection available
- Ionization Bars in Chamber
- Seismic Bracket Kit
Configuration Options - 3D Packaging:
- Optical Focus 1
Configuration Options - Wafer Handling:
- Gen 4 Fanout 300: 300mm wafer size only
- 200mm and 300mm capability.
- Up to 4.0mm warpage for 300mm wafers (0.1 - 0.4Ib/mm stiffness)
- +/-1.2mm Warpage for 200mm wafers (0.9-1.1lb/mm stiffness)
Includes Dual Lip Seal Chuck, Enhanced Chuck Vac Sense, SW options (Multi-Zone EGA, Grid Focus, Single Probe Focus, & Step Specific Processing)