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Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System
Intevac Matrix Solar PVD Thin Film System

Intevac Matrix Solar PVD Thin Film System

Asset #: 64134

Make: Intevac

Model: Matrix

Last Confirm Date: March 09, 2022

Intevac Matrix Solar PVD Thin Film System
Overview:
- Multiple chamber system enabling multi-layer thin film solar cell PVD applications (IBC, Cu Seed, HJT, PERL/T)
- Fully integrated automation for small substrate handling (low wafer breakage < 0.03%)
- High speed transport and carrier technology for high system throughput (> 3000 wph, application dependent)
- Enabling source technology (LSMA) for high target utilization and low cost of ownership
- Integrated deposition chambers for advanced solar cell applications (Cu seed, PERL Back Metal, HJT)
- Multiple chamber load locks enable high quality vacuum (low E-07) in small footprint
- Short green-to-green time with chamber isolation (< 6 hours)
- Easy carrier modification to accommodate different substrate shapes and sizes (156mm, 125mm, square and pseudo-square)
Matrix Unique Design:
- Single row carrier design enables efficient PVD system through compact chamber dimensions
- Small carrier enables high productivity, low cost load / unload mechanism
- Overhead carrier return reduces footprint
- LSMA source enables lowest cost of ownership (target)
Matrix Automated Substrate Handling:
- Integrated automation load / unload
- High throughput (> 3000 wph)
- Reliable performance (< 0.03% breakage rate)
- Flexible substrate sizes
- Extendible to thinner wafers
Matrix Automation:
- Integrated automation load / unload
- High throughput (> 3000 wph)
- Reliable performance (< 0.03% breakage rate)
- Flexible substrate sizes
- Extendible to thinner wafers
LSMA Source:
- High target utilization (>65%)
- Scanning pole
- Tunable scan speed
- High scan acceleration
- Optimal edge erosion profile
- Uniform target temperature control enables stable film properties
- Planar target design beneficial for low target cost and complex materials
- Magnet array is optimized to the target material
- High magnet pole strength enables high pass-through flux (Magnetic films e.g. Nickel)

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