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EVG 520 IS Manual Wafer Load Substrate Bonder
EVG 520 IS Manual Wafer Load Substrate Bonder
EVG 520 IS Manual Wafer Load Substrate Bonder

EVG 520 IS Manual Wafer Load Substrate Bonder

Asset #: 130176

Make: EVG

Model: 520 IS

Wafer Sizes: 2, 3, 4, 5, 6 inch

Last Confirm Date: March 14, 2025

EVG 520 IS Manual Wafer Load Substrate Bonder, 2" to 6"
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Auto opening of bond tool cover
- Windows based control software and operation interface
- Wafer size: up to 6"/150mm capable
- Max Bond Force: 60 kN
- Top side heater: 550°C max. in 1°C steps
- Bottom side heater: 550°C max. in 1°C steps
- Temperature uniformity: ± 1,5 %
- Turbo pump and controller
- Roughing pump
- Load/unload tool
- System computer, monitor, and keyboard
2008 Vintage

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