Solitec 5110 C Photoresist Spin Coater, 3" to 9"
- Control Panel has 5 potentiometers for speed setting with individual 0-99.9s timers
- OEM Operational Manuals and drawings
- 3" Vacuum Chuck
- Wafer Handling: Manual with loading paddle to center wafer
- Solvent Dispense: Pressurized tank required
- Substrate Sizes (Max): 9" Round, 6" square, 9" diagonal rectangular
- Tachometer: Digital readout from optical encoder, 10 rmp resolution
- Acceleration: Variable from 1,000 to 40,000 rpm/sec
- Process Control: Digital timers with manual programming, relay logic
- Time: Variable from 1 to 999 sec in 1 sec increments
Resist Dispense:
- Automatic Teflon diaphragm pump
- With precise dispense adjustment: 0.5 to 38 mlt 1%, viscosity 4 to 10,000 centistokes
- Separate drawback adjustment
Speed Control:
- Closed loop servo with t10 rpm speed control
- Adjustable from 200 to 10,000 rpm
- Digital reference on spin and spread speeds
Standard Process Sequence:
- Resist coat (static or dynamic)
- Spread
- Spin
System Control Panel:
- Digital Tachometer
- Power ON/OFF
- Vacuum ON/OFF
- Start
- Emergency Stop
- Motor Purge Interlock
- Vacuum Interlock
- Resist Select
- Dispense AUTO/OFF
- Spindle Acceleration
- Solvent (optional)
- Nitrogen (optional)
- Resist Dispense
- Spread
- Spin
- Cycle Select
- Spindle Speed
- Digital Timers
Features:
- Single chuck for wafers, masks or substrates
- Solitec proprietary diaphragm type dispense pump
- 100A, 3 sigma, full radius uniformity across a wafer
- Selectable process functions
- Downflow exhaust system for backsplash control
- N2 motor purge and interlock
- Vacuum interlock on wafer chuck
- Optional auto solvent dispense for HMDS
- 5 gallon drain bucket with exhaust
- Closed loop servo speed control for tight process control
- 1,000 to 40,000 rpm/sec acceleration
- High uptime, easy maintenance design
- Polypropelene waste container
- Digital tachometer with direct optical encoder
- t 10 rpm spin speed control
- Solvent dispense before coating (optional)
- N2 blow-off (optional)
- One wafer chuck and loading paddle included
Applications:
- Positive resist coatings on wafers, masks and substrates
- Negative resist coating on wafers, masks and substrates
- PMMA and E-Beam resist coating
- Silicon, GaAs, InP and other semiconductor materials
- Polyimide coatings on wafers, masks and substrates
- Photosensitive polyimide coating
- Multi-layer resists
Process Options:  
- Option B - P/N 5110C-2
- Option A - P/N 5110C-1 N2 Spin Solvent Dispense
- Resist dispense (Tank required)
- Spread speed spin, Final high speed spin, Spin dry (No N2)
    - Resist dispense
    - Spread speed spin
    - Final high speed spin
- Option C - P/N 5110C-3
- Solvent dispense (tank required) N2 Spin
- Resist dispense
- Spread speed spin Final high speed spin
Equipment Options:
- Extra Resist Pumps:  P/N 0967
- 3 gallon stainless steel tanks with metal sheathed teflon supply lines for solvents:
- P/N 0066 For HMDS, and Xylene with Viton seals
- P/N 0070 For N-Butyl Acetate, Acetone, EGMEA and Alcohols with EPR seals
- See page 67 for chemical compatability table
- Extra loading Paddle
- Spares Kit  P/N 001525
- Pre-pump filter for positive or negative resist  P/N 0255
- Additional vacuum chucks
- Small volume, disposable cartridge dispense system for multiple dispense applications
1998 Vintage