Karl Suss SB 6 Bonder
Asset # :
74299
Equipment Make:
Karl Suss
Equipment Model:
SB 6
Type:
Bonder
Wafer Size:
6"
Equipment Configuration:
- Pneumatic Block replaced with a SMC Solenoid Block
- Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C
- Works with the Karl Suss MA6 Aligner for aligned bonding
- Forces up to 20 kN for 6" wafers available
- Supports thermal compression an
- Wafer bonding at pressures 5e-5 to 3e-3 Torr and 50*C to 550*C
- Works with the Karl Suss MA6 Aligner for aligned bonding
- Forces up to 20 kN for 6" wafers available
- Supports thermal compression an
Equipment Pictures:
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Added: October 9, 2023
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Views: 625