ASML PAS 5500 / 300 C Stepper, 8"
- Ceased numerical aperture motor ("NA Ceased at 0.57"). Lens was still usable at 79% of production. However, if you need the full specification we have quote from ASML to change the motor and lens.
- S/W Ver: 8.9.0
- PC Type: LIPC (Linnux PC)
- Disk Drive: 2 disc RAID system
Projection:
- Zeiss DUV 4X Double Telecentric
- NA 0.57-0.4 (*NA is ceased on 0.57)
- 31.1mm Diameter, 22x27.4 Field Size
- Resolution <0.25um
- uDOF >0.7 um at 0.25um and distortion <35nm with Conventional Illumination
Illumination:
- AERIAL Illumination System
- Zoom Variable Coherence
- Zoom Annual Illumination
- 4 Independent Full Field Reticle Masking
- Nitrogen Purging
Wafer Stage Type: Air Bearing Exposure Stage 200mm, SiSiC Wafer Table (Can be set up to run 125-200mm wafers)
Field Size: 31.1mm Diameter, 22x27.4 Field Size 
Reticle Alignment: TTL Dual Beam Alignment
Wafer Alignment:
- ATHENA+TIS 3X0 (Off Axis Alignment System)
- Supports PM, XPA, SPM and NSSM Marks
- SMO OA-TTL 99.7% max vector <15nm
Image Sensor: IQC for fast automated verification of Focus and Overlay
Levelling / AutoFocus:
Two measurement systems:
1) The coarse red measurement system (820 nm)
Capture range +/- 400 um
2) The fine white measurement system (725-1050 nm)
Capture range +/- 23 um
Three measurement methods:
1) Global leveling (3 points on a wafer, red)
2) Coarse leveling (1 point levels the die before exposure, red)
3) Fine leveling ( 4 or less points in the exposure slit, white
Wafer Loader:
- SEMI Standard
- 2x Cassette Wafer Transport System
- 2x Track Interface Ports
- Handles 125, 150 or 200mm flat/notch Wafers
- TFH AlTiC (1.2mm Thick) or Silicon Wafers 0.65-1.2mm
Control Rack Position: OCU Mark V-LHS
Reticle Loader: ARMS - 3 Reticle Libraries (SMIF Ports)
Illumination source: Cymer ELS 5610
Wavelength: 248nm DUV
Barcode Reader: yes
2000 Vintage