EVG 6200 NT Semi Automated Bottom Side Alignment System
Asset # :
73391
Equipment Make:
EVG
Equipment Model:
6200 NT
Type:
Semi Automated Bottom Side Alignment System
Wafer Size:
up to 8"
Equipment Configuration:
- Double side
- Manual handling
- Exposure Modes: Hard, Soft, & Vacuum Contact
- Separation Distance: 0 - 300 µm adjustable via software
- Wafer Thickness: 0.1 - 10 mm (For Top Side)
- Semi Automatic Loading with Mechanical Prealignment on Chuck
- Quick
- Manual handling
- Exposure Modes: Hard, Soft, & Vacuum Contact
- Separation Distance: 0 - 300 µm adjustable via software
- Wafer Thickness: 0.1 - 10 mm (For Top Side)
- Semi Automatic Loading with Mechanical Prealignment on Chuck
- Quick
Equipment Pictures:
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Added: August 23, 2023
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Views: 197