Karl Suss FC 150 Flip Chip Bonder

Asset # : 41968
Equipment Make: Karl Suss
Equipment Model: FC 150
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration:

– Repaired West heater controller
– Laser leveling module
– Dispensing heads (2) for adhesives
– 50kg bond pressure
– Tool size: 2″
– IR heating. 2 x 800W lamps up to1600w
Equipment Pictures:
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  • Added: October 9, 2020

  • Views: 610

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