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Price: $120,000
Karl Suss FC150 Flip Chip Bonder -69445
Price: $120,000
- Asset # : 69445
- Make : Karl Suss
- Model : FC150
- Type : Flip Chip Bonder
- Wafer Size :
- Configuration : -100 KG bond pressure - 20Amps - 220V, 60Hz Optional equipment installed: - Chip Flipper - Automatic Alignment (Cognex 8000) - Advanced Laser Leveling - Universal Bonding Arm (UBA) - High Precision SET Reflow Arm (SRA) - Force Sensor in Stage - This tool powers on, launches software and completes initialization process (tool reset) 1999 Vintage
Karl Suss FC150 Flip Chip Bonder -69445
$120,000.00