Matrix 105 Photoresist Stripper
- Moderate Temperature Resist Strip (80-250 *C)
- Descum / Clean, MEMS Applications
- Single Wafer System- High dose implant (As+, B+, P+)
- Post-polysilicon etch
- Post-metal etch
- Post-oxide etch
- Rework
Handles Variety of substrates:
- Round
- Square
- Ranging from 50 mm to 150 mm
Controlled Resist Removal:
- Post-develop descum (pre-etch)
- Dry/wet process capability
- Uniformity capability (<5% 1σ)
Single Wafer, Multi-Step Processing:
- Precisely controlled & repeatable stripping of each wafer
- 3 programmable steps + overstrip
- Capable of long process times for exceptional control
High Throughput:
>35 WPH on 150mm (60 second process time)
Aluminum Wafer Chuck:
- Provides Fast, Precise, Uniform
- Removal of Resist
Low Particles:
<0.1 particles (>0.3µm) added per cm2
Proven System Performance:
>700 System Ones in use worldwide,
>95% uptime
Small Footprint :
- Only 25” W x 28” D (63.5cm x 71cm)
Process Module Features:
- All Quartz Reactor with Dual Quartz Plasma Isolation Baffle and Wafer Aluminum chuck
Wafer Sizes:
- Handles 100mm, 125mm, 150mm Silicon or GaAs wafers
Optional Capabilities For:
- 75-100mm GaAs wafers
- 50mm GaAs, InP wafers
- Thin Film Head round or
- TFH 4.5” square substrates
- GaAs sapphire carriers up to 6.2”
Gas Control :
- Two independent gas sticks standard.
- 5 LPM and 300sccm (3rd MFC option)