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PacTech Ultra SB 2 300 Automated Solder Bumper
PacTech Ultra SB 2 300 Automated Solder Bumper

PacTech Ultra SB 2 300 Automated Solder Bumper

Asset #: 82526

Make: PacTech

Model: Ultra SB 2 300

Wafer Sizes: 8, 12 inch

Last Confirm Date: August 12, 2024

PacTech Ultra SB 2 300 Automated Solder Bumper, 8", 12"
- 300mm FOUP load port stations (2)
- Flux printing unit with automatic printing process of flux on wafer level. Uses stencil printing.
- Solder ball transfer unit for 60um to 760um
- Aluminum bond stage
- Software: RS232 interface
Robot handling system :
- Two robots with end effector and pre-alignment stations
- Robot vacuum wafer arm: unload/loads 3 wafers per minute

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