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Esec 2100 HS Die Bonder
Esec 2100 HS Die Bonder
Esec 2100 HS Die Bonder

Esec 2100 HS Die Bonder

Asset #: 128433

Make: Esec

Model: 2100 HS

Wafer Sizes: 12 inch

Last Confirm Date: February 06, 2025

Esec 2100 HS Die Bonder, 12"
- Strip Handler 100mm cold Rail (SH2 100cR)
- Magazine Handler Output (MHOUT)
- 300 mm Wafer Handler
- Pneumatic Dispense System (PDS)
- Vision System:
- Dispense Position (DVI)
- Pick Position (PVI)
- Bond Position (BVI)
- Patented Phi-Y Pick & Place
- Integrated Safety Package
- User Interface
- Basic User Management (BUSM)
- Basic Statistics (BSTAT)
- Device Reject Mark Check (DRMC)
- SH2_100cR Strip Handler 100 mm cold Rail
- MHIN Magazine Handler Input hS
- WMP Wafer Mapping Package
- IILL Indirect Illumination 125, dispense or bond position
- HOST Host Communication Interface
- IONC_P Ionizer-Controlled Pick
- PELD Epoxy Level Detection
- BQC Bond Quality Check
- DQC Dispense Quality Check
- PPDS Purge and Pre-Dispense Station hS
- CSR 43210 Strip mapping option
- Refurbished
2014 Vintage

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