Finetech Fineplacer 96 Die Bonder

Asset # : 70655
Equipment Make: Finetech
Equipment Model: Fineplacer 96
Type: Die Bonder
Wafer Size:
Equipment Configuration: Add On Option:
- Flip Chip Module
- Epoxy Dispenser Module
- Pick & Place Module
- UV Curing System
- Heat Plate
- Wafer Ring Holder,
- Accessories, and
- Isolated Table
Equipment Pictures:
Fintech Fineplacer 96 Die Bonder 70655 Image 4

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Fintech Fineplacer 96 Die Bonder 70655 Image 5

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Ad Details

  • Added: April 14, 2023

  • Views: 393

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