Karl Suss / SET FC 150 Flip Chip Bonder Sold
Asset # :
69445
Equipment Make:
Karl Suss
Equipment Model:
FC 150
Type:
Flip Chip Bonder
Wafer Size:
Equipment Configuration:
-100 KG bond pressure
- 20Amps
- 220V, 60Hz
Optional equipment installed:
- Chip Flipper
- Automatic Alignment (Cognex 8000)
- Advanced Laser Leveling
- Universal Bonding Arm (UBA)
- High Precision SET Reflow Arm (SRA)
- Force Sensor in Stage
- This tool
- 20Amps
- 220V, 60Hz
Optional equipment installed:
- Chip Flipper
- Automatic Alignment (Cognex 8000)
- Advanced Laser Leveling
- Universal Bonding Arm (UBA)
- High Precision SET Reflow Arm (SRA)
- Force Sensor in Stage
- This tool
Equipment Pictures:
Equipment Video:
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Added: February 8, 2023
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Views: 1323