Besi / Esec 2100 FC Flip Chip Bonder

Asset # : 68308
Equipment Make: Besi / Esec
Equipment Model: 2100 FC
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration: - Missing some module parts
Equipment Pictures:
Buy Besi / Esec 2100 FC Flip Chip Bonder 68308

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  • Added: December 16, 2022

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