Karl Suss FC 150 Flip Chip Bonder Sold

Asset # : 68088
Equipment Make: Karl Suss
Equipment Model: FC 150
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration: - 100 kg bond pressure
- 2" UBA (upper bond arm)
- 2" chuck
- Includes laser leveling option
- SRA
Equipment Pictures:
Buy Karl Suss FC 150 Flip Chip Bonder 68088

Karl Suss FC 150 Flip Chip Bonder 68088 For Sale Online

Karl Suss FC 150 Flip Chip Bonder 68088 Refurbished

Karl Suss FC 150 Flip Chip Bonder 68088 For Sale

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Purchase Karl Suss FC 150 Flip Chip Bonder 68088

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Karl Suss FC 150 Flip Chip Bonder 68088

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  • Added: November 16, 2022

  • Views: 303

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