Newport / MRSI 705 Die Bonder
Asset # :
67503
Equipment Make:
Newport
Equipment Model:
MRSI 705
Type:
Die Bonder
Wafer Size:
Equipment Configuration:
- Bonding option: COC Eutectic
- Loading and unloading: Wafflepack / Gelpak
- Time: 16 sec/pcs
Accuracy:
- X,Y: ±10 µm at 3σ
- Θ: ±1.0° at 3σ
Size:
- LD Sub: 0.5 mm - 0.8 mm
- LD (Laser diode): 0.2 mm - 1.0 mm
- Loading and unloading: Wafflepack / Gelpak
- Time: 16 sec/pcs
Accuracy:
- X,Y: ±10 µm at 3σ
- Θ: ±1.0° at 3σ
Size:
- LD Sub: 0.5 mm - 0.8 mm
- LD (Laser diode): 0.2 mm - 1.0 mm
Equipment Pictures:
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Added: October 6, 2022
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Views: 365