Rudolph NSX 105 Automated Wafer, Die & Bump Inspection

Asset # : 67156
Equipment Make: Rudolph
Equipment Model: NSX 105 Rev C
Type: Automated Wafer, Die & Bump Inspection
Wafer Size:
Equipment Configuration: With:
- Wafer handling system
- Universal film frame handler
Missing or broken:
- NSK Controller
- Matrox PC
- 24 Volt PS Stage
- X Stage encoder issue
Equipment Pictures:

Send BTG Message:

Inquire

Ad Details

  • Added: September 1, 2022

  • Views: 161

Description

Tags :