Applied Materials Mirra CMP

Asset # : 63988
Equipment Make: Applied Materials
Equipment Model: Mirra
Type: Chemical Mechanical Polishing (CMP) System
Wafer Size: 8"
Equipment Configuration:

– Software version MB60a1
– (QTY: 4) Titan 200mm, three chamber carriers
– (QTY: 3) 20.0” coated platens, ISRM enabled
– ISRM Endpoint software version IB11H2
– Peristaltic pumps, (2) per platen
– Nova patterned recognition unit, none
– (QTY: 4) 200mm we
Equipment Pictures:
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Ad Details

  • Added: March 3, 2022

  • Views: 382

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