Ebara FREX 200 Chemical Mechanical Planarization (CMP) system

Asset # : 62962
Equipment Make: Ebara
Equipment Model: FREX 200
Type: Chemical Mechanical Planarization (CMP) System
Wafer Size: 8"
Equipment Configuration:

– Bottom configuration for: Slurry; CDA; N2; DIW; raw water; chilled water; wastewater
– Top configuration for: Polish and cleaner exhaust
– Load ports: 4
– Polishing unit:
– Topring: GenII 5 Zone carrier with PEEK plate
– Buff station: Round type 10”
– W

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  • Added: January 26, 2022

  • Views: 315

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