Datacon 2200 EVO Dispense Pick and Place Sold
Asset # :
14562
Equipment Make:
Datacon
Equipment Model:
2200 EVO
Type:
Dispense Pick and Place
Wafer Size:
Equipment Configuration:
– Die Handling System
– Upgrade Heated Bond Head
– Single Head Machine
– Epoxy and flux application system
– DC6408 Slide flux
– Substrate Transport System
– Input/Output System
– Wafer Table w/o stretcher
– Wafer lift including wafer changer
– Gel-Pak Ho
Equipment Pictures:
Download Equipment PDF:
Send BTG Message:
InquireAd Details
-
Added: December 1, 2018
-
Views: 775