EVG 501 Wafer Bonder
Asset # :
76000
Equipment Make:
EVG
Equipment Model:
501
Type:
Wafer Bonder
Wafer Size:
Up to 6"
Equipment Configuration:
- Manual wafer load substrate bonder
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Windows based control
- Capable of fusion compression bonding
- Capable of thermal compression bonding
- Capable of anodic bonding
- Ideal for R&D and pilot production applications
- High-vacuum capable bond chamber
- Windows based control
Equipment Pictures:
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Added: January 15, 2024
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Views: 124