Applied Materials Centura II Etch System
Asset # :
75704
Equipment Make:
Applied Materials
Equipment Model:
Centura II
Type:
Etcher
Wafer Size:
Equipment Configuration:
- 2x DPS+ Poly Chambers (Chamber position A, B, 1 Oriend Chamber
- Load Lock: Wide Body Heated Robot: HP+
- Source Generator: Atlas 2012
- Bias Generator: ACG 6B
- RF Match: 0010-36308
- End Point: Monochrometor
- Load Lock: Wide Body Heated Robot: HP+
- Source Generator: Atlas 2012
- Bias Generator: ACG 6B
- RF Match: 0010-36308
- End Point: Monochrometor
Equipment Pictures:
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Added: December 19, 2023
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Views: 87