Besi / Esec DB 2100 hS Die Bonder
Asset # :
73299
Equipment Make:
Besi / Esec
Equipment Model:
DB 2100 HS
Type:
Die Bonder
Wafer Size:
12"
Equipment Configuration:
- Strip Handler SH2 cold rail
- Vision System:
- Pick/exchange position (PVI/EVI)
- Bond position (BVI)
- Vertical indirect illumination bond
Indirect illumination exchange
- Flip module
- Die ejector X/Y axis
- Patented Phi-Y pick & place
- Liquid
- Vision System:
- Pick/exchange position (PVI/EVI)
- Bond position (BVI)
- Vertical indirect illumination bond
Indirect illumination exchange
- Flip module
- Die ejector X/Y axis
- Patented Phi-Y pick & place
- Liquid
Equipment Pictures:
Send BTG Message:
InquireAd Details
-
Added: August 22, 2023
-
Views: 237