ASM ADL 838 LG 2 Die Bonder
Asset # :
72079
Equipment Make:
ASM
Equipment Model:
ADL 838 LG 2
Type:
Die Bonder
Wafer Size:
Equipment Configuration:
Wafer System:
- Input type: clamp ring / wafer expander
- Wafer size: 6" on clamp ring / 8" on expander
Pattern Recognition System:
- PR system: full color, 256 grey levels
Facilities Required:
- Voltage: 100 - 240 VAC (single phase)
- Frequency: 50/60 H
- Input type: clamp ring / wafer expander
- Wafer size: 6" on clamp ring / 8" on expander
Pattern Recognition System:
- PR system: full color, 256 grey levels
Facilities Required:
- Voltage: 100 - 240 VAC (single phase)
- Frequency: 50/60 H
Equipment Pictures:
Equipment Video:
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Added: June 28, 2023
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Views: 637