Finetech Fineplacer 96 Die Bonder

Asset # : 70655
Equipment Make: Finetech
Equipment Model: Fineplacer 96
Type: Die Bonder
Wafer Size:
Equipment Configuration: Add On Option:
- Flip Chip Module
- Epoxy Dispenser Module
- Pick & Place Module
- UV Curing System
- Heat Plate
- Wafer Ring Holder,
- Accessories, and
- Isolated Table
Equipment Pictures:
Fintech Fineplacer 96 Die Bonder 70655 Image 4

Fintech Fineplacer 96 Die Bonder 70655 Image 2

Fintech Fineplacer 96 Die Bonder 70655 For Sale Online

Fintech Fineplacer 96 Die Bonder 70655 Refurbished

Buy Fintech Fineplacer 96 Die Bonder 70655 Online

Fintech Fineplacer 96 Die Bonder 70655 For Sale

Buy Fintech Fineplacer 96 Die Bonder 70655

View Fintech Fineplacer 96 Die Bonder 70655

Fintech Fineplacer 96 Die Bonder 70655

Buy Online Fintech Fineplacer 96 Die Bonder 70655

Fintech Fineplacer 96 Die Bonder 70655 Image 5

Fintech Fineplacer 96 Die Bonder 70655 Image 1

Fintech Fineplacer 96 Die Bonder 70655 Image 3

Check out Fintech Fineplacer 96 Die Bonder 70655

Purchase Fintech Fineplacer 96 Die Bonder 70655

Download Images

Send BTG Message:

Inquire

Ad Details

  • Added: April 14, 2023

  • Views: 377

Description

zz

Tags :