Datacon 2200 EVO Plus Automated Multi Chip Die Bonder Sold

Asset # : 67686
Equipment Make: Datacon
Equipment Model: 2200 EVO Plus
Type: Automated Multi-Chip Die Bonder
Wafer Size:
Equipment Configuration: Dual Head
-ID Axis
-Main Axis
Equipment Pictures:
Buy Datacon 2200 EVO Plus Automated Multi Chip Die Bonder 67686

Check out Datacon 2200 EVO Plus Automated Multi Chip Die Bonder 67686

Datacon 2200 EVO Plus Automated Multi Chip Die Bonder 67686

Datacon 2200 EVO Plus Automated Multi Chip Die Bonder 67686 Image 1

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  • Added: October 18, 2022

  • Views: 390

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