Orthodyne 3700 Plus Wire Wedge Bonder Sold
Asset # :
67037
Equipment Make:
Orthodyne
Equipment Model:
3700 Plus
Type:
Wire Wedge Bonder
Wafer Size:
Equipment Configuration:
- High-frequency transducer technology
- Bond Process Monitoring System (BPM)
- Adapts from manual operation to fully automatic line integration
- GUI-based software structure
- Bond Process Monitoring System (BPM)
- Adapts from manual operation to fully automatic line integration
- GUI-based software structure
Equipment Pictures:
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Added: August 23, 2022
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Views: 142