EVG EV 501 S Bonder
Asset # :
62539
Equipment Make:
EVG
Equipment Model:
EV 501 S
Type:
Bonder
Wafer Size:
Equipment Configuration:
– Anodic
– Pre-Fusion
– Glass Frit
– Thermal Compression
– Both Ambient and Vacuum Bonding Capabilities
Equipment Pictures:
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Added: January 4, 2022
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Views: 184