Datacon / Besi 2200 EVO Multichip Die Bonder Sold
Asset # :
62430
Equipment Make:
Datacon / Besi
Equipment Model:
2200 EVO
Type:
Multi-Chip Die Bonder
Wafer Size:
Equipment Configuration:
– Dual head
– Bond head (Heated 155 C)
– Substrate Camera
– Uhura Camera
– Uplooking Camera
– Wafer Camera
– Substrate and Wafer Reader
– Ejection Tool
– Bond Force Reader
– Wafer Table
– Wafer Lift
– Bond Zone
– Loader Unloader Buffer Track
Equipment Pictures:
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Added: December 7, 2021
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Views: 414