Datacon 8800 Chameo Flip Chip Bonder Sold

Asset # : 58197
Equipment Make: Datacon
Equipment Model: 8800 Chameo
Type: Flip Chip Bonder
Wafer Size:
Equipment Configuration:

– No temperature option
– Flux dipping process
– Double gantry system
– Standard wafer table (w/out stretcher and rotation)
– Wafer transfer system
– Wafer centering station
– Wafer lift
– (2) flip units
– (2) Up-looking cameras and (2) substrate cameras
Equipment Pictures:
1-1-done

4-1-done

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2-1-done

8-1-done

10-2-done

10-1-done

Applied Materials--MCA E-Chuck SNNF Type-11

Applied Materials--MCA E-Chuck SNNF Type-11

9-1-done

5-1-done

7-1-done

6-1-done

1-2-done

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  • Added: January 12, 2021

  • Views: 710

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