Applied Materials Mirra 3400 Chemical Mechanical Polishing (CMP) Sold

Asset # : 38536
Equipment Make: Applied Materials
Equipment Model: Mirra 3400
Type: Chemical Mechanical Polishing (CMP) System
Wafer Size: 6"
Equipment Configuration:

– DIWO (Dry-in wet-out)
– Silicon Oxide, Polyimide, a-Si
– 208 V, 200 A, 45 kVA, Standby 6,5 kVA
Equipment Pictures:
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  • Added: July 13, 2018

  • Views: 3082

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